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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SW 108 (OTTO) Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 50mm, AR @ 976 nm
Plano Convex Lens, Dia 25 mm, Focal Length 100 mm
7440-21-3
Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 4 in x 525 μm
Plano Convex Spherical Lens, Dia 50.8mm, Focal Length 75mm, AR @ 532 nm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.