Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

SW 108 (OTTO) Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.