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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SW 108 (OTTO) Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 150 mm x 625 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano Convex Lens, Dia 25.4 mm, Focal Length 50 mm
7440-21-3
Silicon wafer (single side polished), <100>, N (Phosphorous doped), diam. x thickness 76 mm x 380 μm
BK7 glass substrates, 20 mm dia, 3 mm thick
Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 4 in x 525 μm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.