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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 561 (OTTO) Silicon wafer (single side polished), <111>, N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.275 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Glass wafers, diam. × thickness 2 in × 300 μm
Fused silica wafers dia 100 mm thick 1 mm
BK7 glass substrates, 20 mm dia, 3 mm thick
7440-21-3
Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.