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Specification Sheet

Silicon wafer (single side polished), <111>, N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.275 mm

: SSC 561

: Prime Grade

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: SSC 561 (OTTO) Silicon wafer (single side polished), <111>, N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.275 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.


Properties

: 2 inch

: ± 1%

: 0.275 (275 μm)

: ± 20 μm

: <111>

: ± 0.5°

: N-type, contains phosphorus as dopant

: Single side polished

: < 50 Ω·cm

: < 0.5 nm

: < 30 μm


Safety Information

WGK Germany 2


PackingsPrice (INR)
1 pc 10305.00
10 pc 75069.00
100 pcs POR