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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 561 (OTTO) Silicon wafer (single side polished), <111>, N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.275 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Dielectric coated beam splitter (Multi-layer) 400 nm
7440-21-3
Silicon wafer, both side polished, <100>, N-type, single crystal, dia x thickness 3 in x 500 μm
Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 100 mm x 500 µm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 500mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.