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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SS 405 (OTTO) Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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TPX (Polymethylpentene) windows, Dia 59.75 mm, Thick 5 mm
β Barium borate single crystal (Aperture 15 x 15 mm thick 0.2mm)
7440-21-3
Silicon substrate, single side polished, <100>, 10 mm x 10 mm x 1 mm
Right angle prism, 16 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.