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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SS 126 (OTTO) Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm Cas7440-21-3 - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Dichroic mirror (for 1064/532 nm) Dia 30 mm, Thickness 5 mm
BK7 glass substrates, 20 mm dia, 3 mm thick
Laser Grade Mirror, 50.8 mm Dia (Reflectivity 30%)
Calcium fluoride window diam. x thick 15 mm x 2 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.