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Specification Sheet
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Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm

: SS 126

: 7440-21-3

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: SS 126 (OTTO) Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm Cas7440-21-3 - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Properties

: Crystal optics,Chemically coated windows / substrates

: <100>

: ± 0.5°

: P-type

: Boron as dopant

: 25 mm

: ± 5%

: 1 mm

: ± 5%

: ≤ 5 Å

: Single side

Safety Information

WGK Germany 2

PackingsPrice (INR)
1 pc POR
10 pc POR
100 pc POR
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