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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SS 126 (OTTO) Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm Cas7440-21-3 - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Right angle prism, 40 mm
Potassium Bromide Window, (90mm Dia. x 15mm Thick)
SOI wafers, 6 Inch, Dia 150 mm, P-type, Boron Doped
Dielectric Coated Mirror, Dia 50 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.