Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

SS 126 (OTTO) Silicon substrate, single side polished, <100>, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm Cas7440-21-3 - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.