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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 3155 (OTTO) Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999% - used for the production of the silicon, sputtering is widely used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-57-5
Gold sputtering target, diam. × thickness 57 mm × 0.1 mm, 99.99%
7439-94-3
Lutetium sputtering target, diam. x thickness 75 mm × 3 mm, 99.9%
Fluorine doped tin oxide coated glass slide L × W × D 300 mm × 300 mm × 2.2 mm, surface resistivity ~7 Ω/sq
12025-34-2
Germanium disulphide, 99%+
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.