Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999%

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

S 3155 (OTTO) Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999% - used for the production of the silicon, sputtering is widely used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).