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Specification Sheet
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Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999%

: S 3155

: 7440-21-3

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: S 3155 (OTTO) Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999% - used for the production of the silicon, sputtering is widely used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).

Properties

: Materials science,Sputtering targets

: 99.999%

: Solid

: 2 inch

: ± 5%

: 3 mm

: ± 1%

Safety Information

WGK Germany 2

PackingsPrice (INR)
1 pc POR
10 pc POR
100 pc POR
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