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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SS 087 (OTTO) Silicon substrate, single side polished, <111>, P-type, contains boron as dopant, diam. × thickness 50 mm × 1 mm Cas7440-21-3 - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Sapphire substrate, diam. x thickness 4 in x 0.65 mm
Quartz substrates thick 0.5 mm, size 25.4 mm × 25.4 mm
22398-80-7
Indium phosphide (single crystal substrate), (111)B ± 0.5o
BK7 glass substrates, 50.8 mm dia, 1 mm thick
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.