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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 855 - Silicon wafer (single side polished), <111>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
7440-21-3
Silicon substrate, <100> ± 0.5o
7440-56-4
Germanium single crystal, 50 mm dia, 50 mm length (N type)
7789-24-4
Lithium fluoride, optical windows, 40 mm dia, 15 mm thick (with Al coated on one face for working wavelength 1550nm)
Plano Convex Lens, Dia 10 mm, Focal Length 25 mm
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.