Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 6075 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 4 in x 525 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-21-3
Silicon substrate, single side polished, <111>, P-type, contains boron as dopant, diam. × thickness 50 mm × 1 mm
Dielectric Coated Mirror, Width 50 mm x Height 70 mm, Thickness: 10 mm
Plano Convex Spherical Lens, Focal Length : 250mm
7789-24-4
Lithium fluoride window, 10 x 10 x 2 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.