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: S 6075
: 7440-21-3
: PRIME
: Si
: Double side polished
: 28.09
: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: S 6075 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 4 in x 525 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
: Crystal optics,Chemically coated windows / substrates
: 4 inch
: ± 1%
: 525 μm
: Single side
: P-type
: <100>
: ± 0.5°
: >200 ohm.cm
: Boron as dopant
: < 0.8 nm
WGK Germany 2