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Material used = H-K9L
BK7-135 BK7 glass substrates, 20 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Polarizing Beamsplitter Cube, 10 mm X 10 mm X 10 mm
Plane optical window, 150 mm dia, 8 mm thick
1303-00-0
Gallium arsenide (GaAs substrate), <111>, diam. × thickness 2” (50.8 mm) × 0.35 mm
Glass substrate, 10 x 10 mm, thick 1 mm
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