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Material used = H-K9L
BK7-135 BK7 glass substrates, 20 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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1303-00-0
Gallium arsenide wafers, p-TYPE, dia 76.2mm, thick 500 µm, <100>
7440-56-4
Germanium optical windows, 70 mm dia,15 mm thick, 99.999%
7440-21-3
Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm
LBO crystals, Frequency conversion (SHG OF 1064nm TO 532nm in Y-Z plane)
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.