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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 855 - Silicon wafer (single side polished), <111>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Half wave plate @ 633nm
22398-80-7
Indium phosphide substrates, <100>, semi insulating, contains iron as dopant, diam. × thickness 50.5 mm × 350 μm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 250mm
Plano Convex Cylindrical Lens, Focal Length : 100mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.