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Silicon wafers / substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 153 - Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Silica substrates fused, UV grade, 25 mm dia , 1 mm thick
Mounted Zero Order Half Wave Plates
Dielectric Beam Splitter, dia 100 mm, thick 15 mm
Polarizing Beamsplitter Cube, 25 mm X 25 mm X 25 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.