Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm
: Silicon wafers / substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: SSC 153 - Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
Properties
: 270 nm ±5% (it can be on both sides) dry oxidation
Safety Information
WGK Germany 2
| Packings | Price (INR) |
|
1 pc
|
10809.00
|
|
10 pc
|
89109.00
|
|
100 pc
|
POR
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