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Specification Sheet

Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm

: SSC 153

: Si

: 28.09

: Silicon wafers / substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: SSC 153 - Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.


Properties

: 4 inch

: ± 1%

: 0.525 mm (525 μm)

: ± 25 μm

: <100>

: ± 0.5°

: N-type

: Single side polished

: 0.001-0.005 Ω·cm

: 270 nm ±5% (it can be on both sides) dry oxidation


Safety Information

WGK Germany 2


PackingsPrice (INR)
1 pc 10809.00
10 pc 89109.00
100 pc POR