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Certificate of Analysis

Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm

Code: SSC 153

(For eg. B 1615-0108)

Silicon wafers / substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

SSC 153 - Silicon wafer (single side polished), <100>, N-type, diam. x thickness 4 in x 0.525 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.