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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 6075 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 4 in x 525 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Nd YLF laser rod (1%, a-cut, dia5*110mm, AR/AR@1053nm)
Laser Grade Plano Convex Lens, Dia 50 mm, Focal Length : 200 mm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 100mm, AR @ 880 nm
Plano silver mirror, Dia 25 mm, Thick 6 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.