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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 6075 (OTTO) Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 4 in x 525 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Cerium doped YAG (Ce:YAG) single crystal, Dimensions 50 mm x 50 mm, thick 0.5 mm
Plano Convex Spherical Lens, Focal Length : 1000mm
7789-24-4
Lithium fluoride, optical windows, 40 mm dia, 5 mm thick
Nd:YAG laser mirror, dia 50 mm, thick 5 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.