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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 5716 (OTTO) Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99% - used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
7439-96-5
Manganese sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
1313-99-1
Nickel oxide, sputtering target, diam. x thickness 2 inch x 0.125 inch, 99.9%
7440-48-4
Cobalt sputtering target, diam. x thickness 25.4mm (1.0in) x 1 mm , 99.9%
7440-22-4
Silver sputtering target 99.95% 3 inch dia x 2 mm thick
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.