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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 5716 (OTTO) Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99% - used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Stainless steel - AISI 304, Fe/Cr18%/Ni 10%, plate, thickness 4.2 mm, size 1220 × 610 mm, temper annealed
Stellitee 6 powder, 53-150um
12068-69-8
Bismuth selenide doped with cobalt, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Co)
12136-78-6
Molybdenum disilicide, 10-45 μm, 99.9%
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.