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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
S 5716 (OTTO) Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99% - used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).