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Specification Sheet
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Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm

: SS 360

: 7440-21-3

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: SS 360 (OTTO) Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Properties

: Crystal optics,Chemically coated windows / substrates

: <100> ± 0.5 °

: 1” (25.4±0.2 mm)

: 300 - 400 μm

: ± 5% approx

: One side polished

: Ra < 5 Å

: 1- 10 ohm-cm

Safety Information

WGK Germany 2

PackingsPrice (INR)
1 pc POR
10 pc POR
1000 pcs POR
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