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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SS 360 (OTTO) Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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LBO crystals, Frequency conversion (SHG OF 1064nm TO 532nm in Y-Z plane)
Nd:YAG Laser Rods (1.1% Doping of Nd +3 ion)
Dichroic Beamsplitters, Transmission ≥ 90%@ 280-1100 nm
7789-24-4
Lithium fluoride, optical windows, 50 mm dia, 4 mm thick
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.