Silicon wafer (single side polished), <100>, P-type, diam. x thickness 2 in x 285 µm
: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: SIW081 (OTTOKEMI) Silicon wafer (single side polished), <100>, P-type, diam. x thickness 2 in x 285 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells
Properties
Safety Information
RIDADR NONH for all modes of transport
WGK Germany 2
RTECS VW0400000
| Packings | Price (INR) |
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1 pc
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POR
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10 pc
|
POR
|
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100 pc
|
POR
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