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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SIW081 (OTTOKEMI) Silicon wafer (single side polished), <100>, P-type, diam. x thickness 2 in x 285 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells
RIDADR NONH for all modes of transport
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Stainless steel - AISI 304, Fe/Cr18%/Ni 10%, plate, thickness 4.2 mm, size 1220 × 610 mm, temper annealed
7440-67-7
Zirconium sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.95%
1333-86-4
Carbon black, acetylene, 100% compressed, 99.9%+
7439-96-5
Manganese sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.