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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SIW081 (OTTOKEMI) Silicon wafer (single side polished), <100>, P-type, diam. x thickness 2 in x 285 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells
RIDADR NONH for all modes of transport
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
7440-21-3
Silicon wafer (single substrase), <100>, n-type, contains Phosphorus as dopant, diam. × thickness 2 inch x 0.3 mm
9004-34-6
Cellulose, microcrystalline powder
12060-59-2
Strontium titanate single crystal substrate, Orientation :< 100>+/-0.3degree, Size: 10 x 10 x 1.0 mm
Fe75Ga25 sputtering target 99.95% 3 inch dia x 2 mm thick
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.