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Specification Sheet
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Silicon wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm

: SSC 076

: 7440-21-3

: Prime Grade

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: SSC 076 - Silicon wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.

Properties

: Crystal optics,Chemically coated windows / substrates

: 2 inch

: ± 1%

: 0.5 mm (500 μm)

: ± 20 μm

: <100>

: ± 0.5°

: P-type, contains boron as dopant

: Single side polished

: 1-50 Ω·cm

: < 0.5 nm

: < 30 μm

Safety Information

WGK Germany 2

PackingsPrice (INR)
1 pc 9810.00
10 pc 65799.00
100 pcs POR
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