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Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SSC 570 - Silicon wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
WGK Germany 2
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Quartz window, dia x thickness 20 mm × 2.5 mm
Plano Convex Lens, Dia 50.8 mm, Focal Length 150 mm
7440-21-3
Silicon optical (mono crystalline) windows, 30 mm dia, 10 mm thick, 99.999%
Broadband Non-Polarizing Cube Beam Splitters (25 mm x 25 mm x 25 mm)
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.