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Material used = H-K9L
BK7-135 BK7 glass substrates, 20 mm dia, 3 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Plano convex lens, dia 25.4 mm, focal length 5 cm
Plano Concave Spherical Lens, Dia 25.4 mm, Focal Length -500 mm
Dichroic Mirror, 638 nm Longpass Cutoff
BK7 glass substrates, 50.8 mm dia, 1 mm thick
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.