Silicon sputtering target, diam. × thickness 50 mm × 6 mm, 99.99%

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

S 0243 (OTTO) Silicon sputtering target, diam. × thickness 50 mm × 6 mm, 99.99% - used for the production of the silicon, sputtering is widely used to produce a back reflector layer (made predominantly with aluminum) and front contacts (made with transparent conducting oxides, TCO).