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Material used = H-K9L
BK7-090 BK7 glass substrates, 50.8 mm dia, 1 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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β Barium borate single crystal (Aperture 15 x 15 mm thick 0.5 mm)
Nd YLF laser rod (1%, a-cut, dia5*110mm, AR/AR@1053nm)
7440-21-3
Silicon substrate, single side polished, <111>, P-type, contains boron as dopant, diam. × thickness 50 mm × 1 mm
Dichroic mirror (for 1064/532 nm) Dia 30 mm, Thickness 5 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.