BK7 glass substrates, 50.8 mm dia, 1 mm thick
: BK7-090 BK7 glass substrates, 50.8 mm dia, 1 mm thick - used for anodic bonding or as carrier wafers in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be permanently or temporarily bonded.
Properties
: Both sides optically polished
: ~ 91% at 350 nm wavelength
Safety Information
Safety Information for this product is unavailable at this time.
| Packings | Price (INR) |
|
1 pc
|
8991.00
|
|
10 pc
|
76599.00
|