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M 8227 (OTTO) Molybdenum sputtering target, diam. x thickness 3 inch x 2.5 mm, 99.95% Cas 7439-98-7 - used in electronic and semiconductor application.
WGK Germany 3
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
7440-03-1
Niobium, sputtering target, 99.95% (L x W x Thick 14 x 1 x 2 mm)
7440-21-3
Silicon wafer (single substrase), <100>, p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm
7440-57-5
Gold sputtering target, diam. × thickness 2 in. × 3 mm, 99.99%
Silicon wafer (single substrase), <100>, N-type, contains phosphorus (Ph) as dopant, diam. x thickness 100 mm x 0.525 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.