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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
1314-98-3
Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%
7440-21-3
Silicon wafer (single substrase), <111>, p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm
12068-69-8
Bismuth(III) selenide, - 350 mesh, 99.99%
31501-07-2
Bismuth antimony telluride, 99.99%
Our team of R&D Experts and Scientists have expertise in all areas of research of Lab Chemicals, Nano Technology, Life Science, Custom Synthesis, Chromatography, and many others.
DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.