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Specification Sheet

Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 100 mm x 500 µm

: SW 135

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: SW 135 (OTTO) Silicon wafer (double side polished), <100>, Intrinsic, dia x thickness 100 mm x 500 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.


Properties

: 100 mm

: ± 5%

: 500 μm

: ± 5%

: <100>

: ± 0.5°

: Intrinsic

: Double side polished

: >10000 Ω-cm


Safety Information

WGK Germany 2


PackingsPrice (INR)
1 pc POR
10 pc POR
100 pcs POR