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Specification Sheet

Silicon wafer, single crystal, dia x thickness 3 in x 0.1 mm

: Silicon substrate, single crystal, dia 3 in, thickness 100 μm

: SIS014

: PRIME

: Si

: Double side polished

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: SIS014 Silicon wafer, single crystal, dia x thickness 3 in x 0.1 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.


Properties

: 3 inch (76.2 mm)

: ± 0.5 mm

: 100 μm

: ± 10 μm

: < 5 Å

: Double side polished

: P-type or n-type

: (100) ± 0.5°

: 1- 20 Ohm-cm

: < 15 μm

: < 30 pm


Safety Information

WGK Germany 2


PackingsPrice (INR)
1 pc POR
10 pc POR
Custom size POR