Specification Sheet

Sapphire Wafer, C-plane (0001), diam. x thickness 4 inch x 0.65 mm

Code

: SS 090

Grade

: Scratch Free for front surface with Ra <=0.5nm

Description

: Wafer in cassette vacuum sealed. Packaging provided for wafers.

Categories

Diameter

: 100 mm

Diameter tolerance

: ± 0.2 mm

C-plane sapphire wafer

: 4 inch

Thickness

: 0.65 mm

Thickness Tolerance

: ± 0.2 μm

Orientation

: C-Plane (0001) 0.2 +/- 0.1 deg off M-axis,0 +/- 0.1 deg off A-axis

Primary flat orientation

: A-plane (11-20) +/- 0.2deg

Primary flat length

: 32.5 +/- 2.5 mm

Front surface finish

: Epi-polished

Back surface finish

: Fine Ground

Micro-roughness

: Ra

Laser Marking

: None

Warp

Bow

TTV

Micro-roughness

: Ra= 0.6 μm to 01.4 μm

Information for this product is unavailable at this time.

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