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: Silicon substrate, single crystal, <100>, diam. × thickness in. 50.8 mm × 0.3 mm
: SSC 261
: 7440-21-3
: PRIME
: Si
: Double side polished
: 28.09
: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: SSC 261 - Silicon wafer (single side polished), <100>, diam. × thickness in. 50.8 mm × 0.3 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
: Crystal optics,Chemically coated windows / substrates
: 2 inch (50.8 mm)
: ± 0.5 mm
: 300 μm
: ± 1%
: <100>
: ±0.5 °
: 5 Å on front surface or better
: Front side polished
: ≥ 1x107ohm-cm
: 5 x 105 or less
: < 30 pm
WGK Germany 2