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: S 3051
: 7440-21-3
: Si
: 28.09
: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
: S 3051 Silicon sputtering target, diam. x thickness 4 inch x 4 mm, 99.99% - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
: Metals,Silicon
: 99.99%
: Solid
: 4 inch
: ± 5%
: 4 mm
WGK Germany 2