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Specification Sheet

Silicon sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%

: S 3051

: Si

: 28.09

: Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

: S 3051 Silicon sputtering target, diam. x thickness 4 inch x 4 mm, 99.99% - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.


Properties

: 99.99%

: Solid

: 4 inch

: ± 5%

: 4 mm

: ± 5%


Safety Information

WGK Germany 2


PackingsPrice (INR)
1 pc POR
10 pc POR
Custom size POR