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Silicon wafers or substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.
SIW072 (OTTOKEMI) Silicon wafer (single side polished), <111>, P-type, diam. x thickness 2 in x 285 µm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.
RIDADR NONH for all modes of transport
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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YBCO disk, dia 28 mm, thick 10 mm
112-04-9
n-Octadecyltrichlorosilane, 95%
1309-48-4
Magnesium oxide, (single crystal substrate), 10 x 10 x 0.5 mm, Orientation <111>
Fe33.3Co33.3Ni33.3 sputtering target 99.95%3 inch dia x 2 mm thick
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.