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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 100mm, AR @ 880 nm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 50mm, AR @ 976 nm
7440-21-3
Silicon substrate (single side polished), <100>, P-type, diam. × thickness 1 in. × 300 - 400 μm
7440-56-4
Germanium optical (mono crystalline) windows, 25 mm dia, 10 mm thick, 99.999%
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