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Laser substrases. Most of the applications of fused silica exploit its wide transparency range, which extends from the UV to the near IR. Fused silica is the key starting material for optical fiber, used for telecommunications.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Silicon wafers, P-type, dia 4 inch, thick 0.525 mm [Thermal oxide wafer 100 nm SiO2 layer on Si (100)]
Dichroic Beamsplitters, Transmission ≥ 90%@ 280-1100 nm
Single Crystal Electronic CVD diamond (3.0 x 3.0 mm, 0.30 mm thick)
7440-21-3
Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm
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