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M 7030 (OTTO) Molybdenum sputtering target, diam. x thickness 3 inch x 2.5 mm, 99.95% Cas 7439-98-7 - used in electronic and semiconductor application.
WGK Germany 3
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
For any quries, please write to us at
7440-21-3
Silicon wafer (single substrase), <100>, p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm
Samarium cobalt alloy, sputtering target, diam. x thickness 50.8 mm x 1 mm (1:5%)
7789-78-8
Calcium hydride, 96%
409-21-2
Silicon carbide (4H-SiC) wafers, dia 100 mm, thick 1.5 mm
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.