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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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Indium phosphide (single crystal substrate), (111)B ± 0.5o
1303-00-0
Gallium arsenide wafers, N-TYPE, dia 76.2 mm, thick 500 µm, <100>
Laser Grade Window, 38.1 mm Dia
Plano Convex Spherical Lens, Dia 50.8mm, Focal Length 75mm, AR @ 532 nm
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