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A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a create a rough surface to increase their efficiency.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
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Certificate Of Analysis
(For eg. B 1615-0108)
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Dielectric Coated Mirror, Width 50 mm x Height 70 mm, Thickness: 10 mm
Plano Convex Spherical Lens, Dia 50.8mm, Focal Length 75mm, AR @ 532 nm
Plano Convex Spherical Lens, Dia 25.4mm, Focal Length 100mm, AR @ 940 nm
Sapphire single crystal wafer, C-plane <0001>, dia. x thickness 100 mm x 1 mm
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