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Fused silica is the key starting material for opticals
FS027 (OTTO) Fused silica wafers dia 100 mm thick 0.5 mm - used for telecommunications.
Safety Information for this product is unavailable at this time.
Certificate Of Analysis
(For eg. B 1615-0108)
Other Documents
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7440-21-3
Silicon wafer, <100>, P-type, contains boron as dopant, diam. × thickness 4 inch × 0.525mm
Bi-Telecentric Lens (C-Mount) for 2/3” detector, magnification 0.345
Nd:YAG Laser Rods, Doping Concentration 0.4 at%
Silicon wafers, P-type, dia 4 inch, thick 0.525 mm [Thermal oxide wafer 100 nm SiO2 layer on Si (100)]
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DisclaimerThe above particulars do not release the customer from the obligation to carry out an inspection of goods received. Not for medical, household or any other uses, for lab use only, Please test before use.