Silicon wafer (single side polished), <100>, diam. × thickness 50.8 mm × 0.3 mm

Silicon wafers or a “slice” of substrate find applications in the fabrication of integrated circuits, solar cells etc. They serve as a substrate for various microelectronic devices.

SSC 261 - Silicon wafer (single side polished), <100>, diam. × thickness in. 50.8 mm × 0.3 mm - used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells.